Camera module design with lead frame and plastic moulding

ABSTRACT

A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmoulding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

BACKGROUND

Technical Field

This disclosure relates generally to camera modules and morespecifically to camera modules for mobile computing devices.

Description of the Related Art

The advent of small, mobile multipurpose devices such as smartphones andtablet or pad devices has resulted in a need for high-resolution, smallform factor cameras for integration in the devices.

For high-end miniature cameras, it is common to incorporate a ceramicsubstrate with contact leads for contact with the image sensor. Such asubstrate adds both to the weight and size of the camera device.

Miniature cameras are typically used in mobile devices such ascellphones and other multifunction devices. In such devices, space is apremium and every effort is made to minimize the camera size and weight.

Demands on improvements to performance of such miniature cameras areconstant, as are demands for continued miniaturization, given the addedfeatures and devices added to such mobile devices.

Further to this, there is a strong desire, for a given size of camera,to fit bigger lenses and image sensors to improve image quality, andhence there is a desire to reduce the size of structural components.However, some small-sized components, including various structuralcomponents, can be relatively complex to assemble and can be vulnerableto failure, based at least in part upon small size and complexity ofvarious components.

SUMMARY OF EMBODIMENTS

Some embodiments include an image sensor, a flexible printed circuitwith a first side affixed to a first side of the image sensor, aplurality of metallic leads affixed to a second side of the imagesensor, and a lens assembly for directing light to the image sensorarticulated to the image sensor by one or more of an overmouldingattached to the leads and the flexible printed circuit. The first sideof the image sensor is a side opposite the second side of the imagesensor. The leads provide connection between the image sensor and leadsin the flexible printed circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a block diagram of a portable multifunction devicewith a camera in accordance with some embodiments.

FIG. 2 depicts a portable multifunction device having a camera inaccordance with some embodiments.

FIG. 3A illustrates a cutaway view of an example embodiment of a cameramodule or assembly that may, for example, be used to provide in smallform factor cameras, according to at least some embodiments.

FIG. 3B depicts an exploded parts view of an example embodiment of acamera module or assembly that may, for example, be used to provide insmall form factor cameras, according to at least some embodiments.

FIG. 3C is a flowchart of an assembly process for assembling a cameramodule, according to at least some embodiments.

FIG. 4 depicts a lead frame apparatus representing an embodiment of alead frame for an image sensor that may, for example, be used in smallform factor cameras, according to at least some embodiments.

FIG. 5 illustrates a lead frame apparatus and an image sensor that may,for example, be used in small form factor cameras, according to at leastsome embodiments.

FIG. 6 depicts articulation of a lead frame apparatus and an imagesensor that may, for example, be used in small form factor cameras,according to at least some embodiments.

FIG. 7 illustrates articulation of a flexible printed circuit to a leadframe apparatus and an image sensor that may, for example, be used insmall form factor cameras, according to at least some embodiments.

FIG. 8 depicts an assembly resulting from articulation of a flexibleprinted circuit to a lead frame apparatus and an image sensor that may,for example, be used in small form factor cameras, according to at leastsome embodiments.

FIG. 9 illustrates an assembly resulting from articulation of anovermoulding to a flexible printed circuit, a lead frame apparatus, andan image sensor that may, for example, be used in small form factorcameras, according to at least some embodiments.

FIG. 10 depicts an assembly resulting from articulation of anovermoulding to a flexible printed circuit, a lead frame apparatus, andan image sensor that may, for example, be used in small form factorcameras, according to at least some embodiments.

FIG. 11 illustrates articulation of a lens assembly to an assemblyresulting from articulation of an overmoulding to a flexible printedcircuit, a lead frame apparatus, and an image sensor that may, forexample, be used in small form factor cameras, according to at leastsome embodiments.

FIG. 12 depicts articulation of a flexible printed circuit to a metallicstiffener that may, for example, be used in small form factor cameras,according to at least some embodiments.

FIG. 13 illustrates articulation of a flexible printed circuit to a leadframe apparatus, a metallic stiffener, and an image sensor that may, forexample, be used in small form factor cameras, according to at leastsome embodiments.

FIG. 14 illustrates articulation of a carrier frame to a flexibleprinted circuit, a lead frame apparatus, a metallic stiffener, and animage sensor that may, for example, be used in small form factorcameras, according to at least some embodiments.

FIG. 15 depicts a result of the articulation of a carrier frame to aflexible printed circuit, a lead frame apparatus, a metallic stiffener,and an image sensor that may, for example, be used in small form factorcameras, according to at least some embodiments.

FIG. 16 illustrates articulation of an overmoulding to a result of thearticulation of a carrier frame to a flexible printed circuit, a leadframe apparatus, a metallic stiffener, and an image sensor that may, forexample, be used in small form factor cameras, according to at leastsome embodiments.

FIG. 17 depicts a result of removal of surplus metal from anarticulation of an overmoulding to a result of the articulation of acarrier frame to a flexible printed circuit, a lead frame apparatus, ametallic stiffener, and an image sensor that may, for example, be usedin small form factor cameras, according to at least some embodiments.

FIG. 18 illustrates a result of removal of surplus metal from anarticulation of an overmoulding to a result of the articulation of acarrier frame to a flexible printed circuit, a lead frame apparatus, ametallic stiffener, and an image sensor that may, for example, be usedin small form factor cameras, according to at least some embodiments.

FIG. 19 depicts an example of a camera module articulated to anarticulation of an overmoulding to a result of the articulation of acarrier frame to a flexible printed circuit, a lead frame apparatus, ametallic stiffener, and an image sensor that may, for example, be usedin small form factor cameras, according to at least some embodiments.

FIG. 20 is a flowchart of a method for manufacturing a camera assembly,according to at least some embodiments.

FIG. 21 is a flowchart of a method for manufacturing a camera assembly,according to at least some embodiments.

FIG. 22 is a flowchart of a method for manufacturing a camera assembly,according to at least some embodiments.

FIG. 23 illustrates an example computer system configured to implementaspects of the methods and systems described herein, according to someembodiments.

This specification includes references to “one embodiment” or “anembodiment.” The appearances of the phrases “in one embodiment” or “inan embodiment” do not necessarily refer to the same embodiment.Particular features, structures, or characteristics may be combined inany suitable manner consistent with this disclosure.

“Including.” This term is open-ended. As used in the appended claims,this term does not foreclose additional structure or steps. Consider aclaim that recites: “An apparatus including one or more processor units. . . .” Such a claim does not foreclose the apparatus from includingadditional components (e.g., a network interface unit, graphicscircuitry, etc.).

“Configured To.” Various units, circuits, or other components may bedescribed or claimed as “configured to” perform a task or tasks. In suchcontexts, “configured to” is used to connote structure by indicatingthat the units/circuits/components include structure (e.g., circuitry)that performs those task or tasks during operation. As such, theunit/circuit/component can be said to be configured to perform the taskeven when the specified unit/circuit/component is not currentlyoperational (e.g., is not on). The units/circuits/components used withthe “configured to” language include hardware—for example, circuits,memory storing program instructions executable to implement theoperation, etc. Reciting that a unit/circuit/component is “configuredto” perform one or more tasks is expressly intended not to invoke 35U.S.C. §112, sixth paragraph, for that unit/circuit/component.Additionally, “configured to” can include generic structure (e.g.,generic circuitry) that is manipulated by software and/or firmware(e.g., an FPGA or a general-purpose processor executing software) tooperate in manner that is capable of performing the task(s) at issue.“Configure to” may also include adapting a manufacturing process (e.g.,a semiconductor fabrication facility) to fabricate devices (e.g.,integrated circuits) that are adapted to implement or perform one ormore tasks.

“First,” “Second,” etc. As used herein, these terms are used as labelsfor nouns that they precede, and do not imply any type of ordering(e.g., spatial, temporal, logical, etc.). For example, a buffer circuitmay be described herein as performing write operations for “first” and“second” values. The terms “first” and “second” do not necessarily implythat the first value must be written before the second value.

“Based On.” As used herein, this term is used to describe one or morefactors that affect a determination. This term does not forecloseadditional factors that may affect a determination. That is, adetermination may be solely based on those factors or based, at least inpart, on those factors. Consider the phrase “determine A based on B.”While in this case, B is a factor that affects the determination of A,such a phrase does not foreclose the determination of A from also beingbased on C. In other instances, A may be determined based solely on B.

DETAILED DESCRIPTION Introduction to Camera Module Embodiments

Some embodiments include a camera module. In some embodiments, thecamera module includes an image sensor, a flexible printed circuit witha first side affixed to a first side of the image sensor, and aplurality of metallic leads affixed to a second side of the imagesensor. In some embodiments, the first side of the image sensor is aside opposite the second side of the image sensor. In some embodiments,the leads provide connection between the image sensor and leads in theflexible printed circuit. In some embodiments, the camera moduleincludes a lens assembly for directing light to the image sensorarticulated to the image sensor by one or more of an overmouldingattached to the lead frame and the flexible printed circuit.

In some embodiments, the camera module includes a metallic strip forelectromagnetic shielding of the image sensor. In some embodiments, themetallic strip is embedded in the overmoulding. In some embodiments, thecamera module further includes a camera actuator motor articulated tothe overmoulding for adjusting a position of a lens of the lens assemblyrelative to the image sensor. In some embodiments, In some embodiments,the lens assembly includes a fixed focus lens holder for maintaining afixed position of a lens of the lens assembly relative to the imagesensor.

In some embodiments, the camera module further includes a metallicstiffener affixed to a second side of the flexible printed circuit. Insome embodiments, the second side of the flexible printed circuit isopposite a first side of the flexible printed circuit. In someembodiments, the metallic stiffener includes one or more ledges foldedto enclose the overmoulding on one or more sides.

In some embodiments, the camera module further includes a metallicstiffener affixed to a second side of the flexible printed circuit. Insome embodiments, the second side of the flexible printed circuit isopposite a first side of the flexible printed circuit.

In some embodiments, the camera module further includes a voice coilmotor articulated to the overmoulding for adjusting a position of a lensof the lens assembly relative to the image sensor.

Some embodiments include an image sensor assembly. In some embodiments,the image sensor assembly includes an image sensor, a flexible printedcircuit with a first side affixed to a first side of the image sensor,and a metallic stiffener affixed to a second side of the flexibleprinted circuit. In some embodiments, the second side of the flexibleprinted circuit is opposite a first side of the flexible printedcircuit.

In some embodiments, the metallic stiffener includes one or more ledgesfolded to enclose the overmoulding on one or more sides. In someembodiments, the metallic stiffener includes one or more ledges epoxiedto the overmoulding on one or more sides. In some embodiments, the imagesensor assembly includes a plurality of metallic leads affixed to asecond side of the image sensor. In some embodiments, the leads provideconnection between the image sensor and leads in the flexible printedcircuit.

In some embodiments, the image sensor assembly includes a plurality ofmetallic leads affixed to a second side of the image sensor. In someembodiments, the plurality of metallic leads provides a wire bondconnection from the flexible printed circuit to the image sensor. Insome embodiments, the image sensor assembly includes a plurality ofmetallic leads affixed to a second side of the image sensor. In someembodiments, the plurality of metallic leads provides a connection fromthe flexible printed circuit to the image sensor through a pillar bumpincluding a copper alloy.

In some embodiments, the image sensor assembly includes a plurality ofmetallic leads affixed to a second side of the image sensor. In someembodiments, the first side of the image sensor is a side opposite thesecond side of the image sensor, and the leads provide connectionbetween the image sensor and leads in the flexible printed circuit.

Some embodiments include a method for assembling an image sensorassembly. In some embodiments, the method includes attaching an imagesensor to a flexible printed circuit with a first side affixed to afirst side of the image sensor, and attaching a metallic stiffener to asecond side of the flexible printed circuit. In some embodiments, thesecond side of the flexible printed circuit is opposite a first side ofthe flexible printed circuit.

In some embodiments, the method includes folding the metallic stiffenerto create one or more ledges to enclose an overmoulding on one or moresides. In some embodiments, the method includes dispensing epoxy ontothe metallic stiffener to secure one or more ledges to an overmouldingon one or more sides. In some embodiments, the method includes attachinga plurality of metallic leads affixed to a second side of the imagesensor. In some embodiments, the leads provide connection between theimage sensor and leads in the flexible printed circuit.

In some embodiments, the method includes attaching a plurality ofmetallic leads affixed to a second side of the image sensor. In someembodiments, the plurality of metallic leads provides a wire bondconnection from the flexible printed circuit to the image sensor. Insome embodiments, the method includes attaching a plurality of metallicleads affixed to a second side of the image sensor. In some embodiments,the plurality of metallic leads provides a connection from the flexibleprinted circuit to the image sensor through a pillar bump including acopper alloy.

Multifunction Device Examples

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. In the following detaileddescription, numerous specific details are set forth in order to providea thorough understanding of the present disclosure. However, it will beapparent to one of ordinary skill in the art that some embodiments maybe practiced without these specific details. In other instances,well-known methods, procedures, components, circuits, and networks havenot been described in detail so as not to unnecessarily obscure aspectsof the embodiments.

It will also be understood that, although the terms first, second, etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first contact could be termed asecond contact, and, similarly, a second contact could be termed a firstcontact, without departing from the intended scope. The first contactand the second contact are both contacts, but they are not the samecontact.

The terminology used in the description herein is for the purpose ofdescribing particular embodiments only and is not intended to belimiting. As used in the description and the appended claims, thesingular forms “a”, “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willalso be understood that the term “and/or” as used herein refers to andencompasses any and all possible combinations of one or more of theassociated listed items. It will be further understood that the terms“includes,” “including,” “includes,” and/or “including,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

As used herein, the term “if” may be construed to mean “when” or “upon”or “in response to determining” or “in response to detecting,” dependingon the context. Similarly, the phrase “if it is determined” or “if [astated condition or event] is detected” may be construed to mean “upondetermining” or “in response to determining” or “upon detecting [thestated condition or event]” or “in response to detecting [the statedcondition or event],” depending on the context.

Embodiments of electronic devices, user interfaces for such devices, andassociated processes for using such devices are described. In someembodiments, the device is a portable communications device, such as amobile telephone, that also contains other functions, such as PDA and/ormusic player functions. Example embodiments of portable multifunctiondevices include, without limitation, the iPhone®, iPod Touch®, and iPad®devices from Apple Inc. of Cupertino, Calif. Other portable electronicdevices, such as laptops, cameras, cell phones, or tablet computers, mayalso be used. It should also be understood that, in some embodiments,the device is not a portable communications device, but is a desktopcomputer with a camera. In some embodiments, the device is a gamingcomputer with orientation sensors (e.g., orientation sensors in a gamingcontroller). In other embodiments, the device is not a portablecommunications device, but is a camera.

In the discussion that follows, an electronic device that includes adisplay and a touch-sensitive surface is described. It should beunderstood, however, that the electronic device may include one or moreother physical user-interface devices, such as a physical keyboard, amouse and/or a joystick.

The device typically supports a variety of applications, such as one ormore of the following: a drawing application, a presentationapplication, a word processing application, a website creationapplication, a disk authoring application, a spreadsheet application, agaming application, a telephone application, a video conferencingapplication, an e-mail application, an instant messaging application, aworkout support application, a photo management application, a digitalcamera application, a digital video camera application, a web browsingapplication, a digital music player application, and/or a digital videoplayer application.

The various applications that may be executed on the device may use atleast one common physical user-interface device, such as thetouch-sensitive surface. One or more functions of the touch-sensitivesurface as well as corresponding information displayed on the device maybe adjusted and/or varied from one application to the next and/or withina respective application. In this way, a common physical architecture(such as the touch-sensitive surface) of the device may support thevariety of applications with user interfaces that are intuitive andtransparent to the user.

Attention is now directed toward embodiments of portable devices withcameras. FIG. 1 is a block diagram illustrating portable multifunctiondevice 100 with camera 164 in accordance with some embodiments. Camera164 is sometimes called an “optical sensor” for convenience, and mayalso be known as or called an optical sensor system. Device 100 mayinclude memory 102 (which may include one or more computer readablestorage mediums), memory controller 122, one or more processing units(CPU's) 120, peripherals interface 118, RF circuitry 108, audiocircuitry 110, speaker 111, touch-sensitive display system 112,microphone 113, input/output (I/O) subsystem 106, other input or controldevices 116, and external port 124. Device 100 may include one or moreoptical sensors 164. These components may communicate over one or morecommunication buses or signal lines 103.

It should be appreciated that device 100 is only one example of aportable multifunction device, and that device 100 may have more orfewer components than shown, may combine two or more components, or mayhave a different configuration or arrangement of the components. Thevarious components shown in FIG. 28 may be implemented in hardware,software, or a combination of hardware and software, including one ormore signal processing and/or application specific integrated circuits.

Memory 102 may include high-speed random access memory and may alsoinclude non-volatile memory, such as one or more magnetic disk storagedevices, flash memory devices, or other non-volatile solid-state memorydevices. Access to memory 102 by other components of device 100, such asCPU 120 and the peripherals interface 118, may be controlled by memorycontroller 122.

Peripherals interface 118 can be used to couple input and outputperipherals of the device to CPU 120 and memory 102. The one or moreprocessors 120 run or execute various software programs and/or sets ofinstructions stored in memory 102 to perform various functions fordevice 100 and to process data.

In some embodiments, peripherals interface 118, CPU 120, and memorycontroller 122 may be implemented on a single chip, such as chip 104. Insome other embodiments, they may be implemented on separate chips.

RF (radio frequency) circuitry 108 receives and sends RF signals, alsocalled electromagnetic signals. RF circuitry 108 converts electricalsignals to/from electromagnetic signals and communicates withcommunications networks and other communications devices via theelectromagnetic signals. RF circuitry 108 may include well-knowncircuitry for performing these functions, including but not limited toan antenna system, an RF transceiver, one or more amplifiers, a tuner,one or more oscillators, a digital signal processor, a CODEC chipset, asubscriber identity module (SIM) card, memory, and so forth. RFcircuitry 108 may communicate with networks, such as the Internet, alsoreferred to as the World Wide Web (WWW), an intranet and/or a wirelessnetwork, such as a cellular telephone network, a wireless local areanetwork (LAN) and/or a metropolitan area network (MAN), and otherdevices by wireless communication. The wireless communication may useany of a variety of communications standards, protocols andtechnologies, including but not limited to Global System for MobileCommunications (GSM), Enhanced Data GSM Environment (EDGE), high-speeddownlink packet access (HSDPA), high-speed uplink packet access (HSUPA),wideband code division multiple access (W-CDMA), code division multipleaccess (CDMA), time division multiple access (TDMA), Bluetooth, WirelessFidelity (Wi-Fi) (e.g., IEEE 802.11a, IEEE 802.11b, IEEE 802.11g and/orIEEE 802.11n), voice over Internet Protocol (VoIP), Wi-MAX, a protocolfor e-mail (e.g., Internet message access protocol (IMAP) and/or postoffice protocol (POP)), instant messaging (e.g., extensible messagingand presence protocol (XMPP), Session Initiation Protocol for InstantMessaging and Presence Leveraging Extensions (SIMPLE), Instant Messagingand Presence Service (IMPS)), and/or Short Message Service (SMS), or anyother suitable communication protocol, including communication protocolsnot yet developed as of the filing date of this document.

Audio circuitry 110, speaker 111, and microphone 113 provide an audiointerface between a user and device 100. Audio circuitry 110 receivesaudio data from peripherals interface 118, converts the audio data to anelectrical signal, and transmits the electrical signal to speaker 111.Speaker 111 converts the electrical signal to human-audible sound waves.Audio circuitry 110 also receives electrical signals converted bymicrophone 113 from sound waves. Audio circuitry 110 converts theelectrical signal to audio data and transmits the audio data toperipherals interface 118 for processing. Audio data may be retrievedfrom and/or transmitted to memory 102 and/or RF circuitry 108 byperipherals interface 118. In some embodiments, audio circuitry 110 alsoincludes a headset jack (e.g., 212, FIG. 2). The headset jack providesan interface between audio circuitry 110 and removable audioinput/output peripherals, such as output-only headphones or a headsetwith both output (e.g., a headphone for one or both ears) and input(e.g., a microphone).

I/O subsystem 106 couples input/output peripherals on device 100, suchas touch screen 112 and other input control devices 116, to peripheralsinterface 118. I/O subsystem 106 may include display controller 156 andone or more input controllers 160 for other input or control devices.The one or more input controllers 160 receive/send electrical signalsfrom/to other input or control devices 116. The other input controldevices 116 may include physical buttons (e.g., push buttons, rockerbuttons, etc.), dials, slider switches, joysticks, click wheels, and soforth. In some alternate embodiments, input controller(s) 160 may becoupled to any (or none) of the following: a keyboard, infrared port,USB port, and a pointer device such as a mouse. The one or more buttons(e.g., 208, FIG. 2) may include an up/down button for volume control ofspeaker 111 and/or microphone 113. The one or more buttons may include apush button (e.g., 206, FIG. 2).

Touch-sensitive display 112 provides an input interface and an outputinterface between the device and a user. Display controller 156 receivesand/or sends electrical signals from/to touch screen 112. Touch screen112 displays visual output to the user. The visual output may includegraphics, text, icons, video, and any combination thereof (collectivelytermed “graphics”). In some embodiments, some or all of the visualoutput may correspond to user-interface objects.

Touch screen 112 has a touch-sensitive surface, sensor or set of sensorsthat accepts input from the user based on haptic and/or tactile contact.Touch screen 112 and display controller 156 (along with any associatedmodules and/or sets of instructions in memory 102) detect contact (andany movement or breaking of the contact) on touch screen 112 andconverts the detected contact into interaction with user-interfaceobjects (e.g., one or more soft keys, icons, web pages or images) thatare displayed on touch screen 112. In an example embodiment, a point ofcontact between touch screen 112 and the user corresponds to a finger ofthe user.

Touch screen 112 may use LCD (liquid crystal display) technology, LPD(light emitting polymer display) technology, or LED (light emittingdiode) technology, although other display technologies may be used inother embodiments. Touch screen 112 and display controller 156 maydetect contact and any movement or breaking thereof using any of avariety of touch sensing technologies now known or later developed,including but not limited to capacitive, resistive, infrared, andsurface acoustic wave technologies, as well as other proximity sensorarrays or other elements for determining one or more points of contactwith touch screen 112. In an example embodiment, projected mutualcapacitance sensing technology is used.

Touch screen 112 may have a video resolution in excess of 100 dpi. Insome embodiments, the touch screen has a video resolution ofapproximately 160 dpi. The user may make contact with touch screen 112using any suitable object or appendage, such as a stylus, a finger, andso forth. In some embodiments, the user interface is designed to workprimarily with finger-based contacts and gestures, which can be lessprecise than stylus-based input due to the larger area of contact of afinger on the touch screen. In some embodiments, the device translatesthe rough finger-based input into a precise pointer/cursor position orcommand for performing the actions desired by the user.

In some embodiments, in addition to the touch screen, device 100 mayinclude a touchpad (not shown) for activating or deactivating particularfunctions. In some embodiments, the touchpad is a touch-sensitive areaof the device that, unlike the touch screen, does not display visualoutput. The touchpad may be a touch-sensitive surface that is separatefrom touch screen 112 or an extension of the touch-sensitive surfaceformed by the touch screen.

Device 100 also includes power system 162 for powering the variouscomponents. Power system 162 may include a power management system, oneor more power sources (e.g., battery, alternating current (AC)), arecharging system, a power failure detection circuit, a power converteror inverter, a power status indicator (e.g., a light-emitting diode(LED)) and any other components associated with the generation,management and distribution of power in portable devices.

Device 100 may also include one or more optical sensors or cameras 164.FIG. 28 shows an optical sensor coupled to optical sensor controller 158in I/O subsystem 106. Optical sensor 164 may include charge-coupleddevice (CCD) or complementary metal-oxide semiconductor (CMOS)phototransistors. Optical sensor 164 receives light from theenvironment, projected through one or more lens, and converts the lightto data representing an image, video, and/or other optical data such asa depth map. In conjunction with imaging module 143 (also called acamera module), optical sensor 164 may capture still images, video,and/or other optical data such as depth maps. In some embodiments, anoptical sensor is located on the back of device 100, opposite touchscreen display 112 on the front of the device, so that the touch screendisplay may be used as a viewfinder for still and/or video imageacquisition. In some embodiments, another optical sensor is located onthe front of the device so that the user's image may be obtained forvideoconferencing while the user views the other video conferenceparticipants on the touch screen display. While a optical sensor inputmodule 158 is explicitly shown in FIG. 1, a person of ordinary skill inthe art will readily ascertain, in light of having read the presentdisclosure, that the methods, processes and systems described herein maybe implemented in many of the hardware and software components andsystems described herein without departing from the scope and intent ofthe present disclosure.

Device 100 may also include one or more proximity sensors 166. FIG. 28shows proximity sensor 166 coupled to peripherals interface 118.Alternately, proximity sensor 166 may be coupled to input controller 160in I/O subsystem 106. In some embodiments, the proximity sensor turnsoff and disables touch screen 112 when the multifunction device isplaced near the user's ear (e.g., when the user is making a phone call).

Device 100 includes one or more orientation sensors 168. In someembodiments, the one or more orientation sensors include one or moreaccelerometers (e.g., one or more linear accelerometers and/or one ormore rotational accelerometers). In some embodiments, the one or moreorientation sensors include one or more gyroscopes. In some embodiments,the one or more orientation sensors include one or more magnetometers.In some embodiments, the one or more orientation sensors include one ormore of global positioning system (GPS), Global Navigation SatelliteSystem (GLONASS), and/or other global navigation system receivers. TheGPS, GLONASS, and/or other global navigation system receivers may beused for obtaining information concerning the location and orientation(e.g., portrait or landscape) of device 100. In some embodiments, theone or more orientation sensors include any combination oforientation/rotation sensors. FIG. 28 shows the one or more orientationsensors 168 coupled to peripherals interface 118. Alternately, the oneor more orientation sensors 168 may be coupled to an input controller160 in I/O subsystem 106. In some embodiments, information is displayedon the touch screen display in a portrait view or a landscape view basedon an analysis of data received from the one or more orientationsensors.

In some embodiments, the software components stored in memory 102include operating system 126, communication module (or set ofinstructions) 128, contact/motion module (or set of instructions) 130,graphics module (or set of instructions) 132, text input module (or setof instructions) 134, Global Positioning System (GPS) module (or set ofinstructions) 135, optical sensor input module 158 and applications (orsets of instructions) 136. Furthermore, in some embodiments memory 102stores device/global internal state 157. Device/global internal state157 includes one or more of: active application state, indicating whichapplications, if any, are currently active; display state, indicatingwhat applications, views or other information occupy various regions oftouch screen display 112; sensor state, including information obtainedfrom the device's various sensors and input control devices 116; andlocation information concerning the device's location and/or attitude.

Operating system 126 (e.g., Darwin, RTXC, LINUX, UNIX, OS X, WINDOWS, oran embedded operating system such as VxWorks) includes various softwarecomponents and/or drivers for controlling and managing general systemtasks (e.g., memory management, storage device control, powermanagement, etc.) and facilitates communication between various hardwareand software components.

Communication module 128 facilitates communication with other devicesover one or more external ports 124 and also includes various softwarecomponents for handling data received by RF circuitry 108 and/orexternal port 124. External port 124 (e.g., Universal Serial Bus (USB),FIREWIRE, etc.) is adapted for coupling directly to other devices orindirectly over a network (e.g., the Internet, wireless LAN, etc.). Insome embodiments, the external port is a multi-pin (e.g., 30-pin)connector.

Contact/motion module 130 may detect contact with touch screen 112 (inconjunction with display controller 156) and other touch sensitivedevices (e.g., a touchpad or physical click wheel). Contact/motionmodule 130 includes various software components for performing variousoperations related to detection of contact, such as determining ifcontact has occurred (e.g., detecting a finger-down event), determiningif there is movement of the contact and tracking the movement across thetouch-sensitive surface (e.g., detecting one or more finger-draggingevents), and determining if the contact has ceased (e.g., detecting afinger-up event or a break in contact). Contact/motion module 130receives contact data from the touch-sensitive surface. Determiningmovement of the point of contact, which is represented by a series ofcontact data, may include determining speed (magnitude), velocity(magnitude and direction), and/or an acceleration (a change in magnitudeand/or direction) of the point of contact. These operations may beapplied to single contacts (e.g., one finger contacts) or to multiplesimultaneous contacts (e.g., “multitouch”/multiple finger contacts). Insome embodiments, contact/motion module 130 and display controller 156detect contact on a touchpad.

Contact/motion module 130 may detect a gesture input by a user.Different gestures on the touch-sensitive surface have different contactpatterns. Thus, a gesture may be detected by detecting a particularcontact pattern. For example, detecting a finger tap gesture includesdetecting a finger-down event followed by detecting a finger-up (liftoff) event at the same position (or substantially the same position) asthe finger-down event (e.g., at the position of an icon). As anotherexample, detecting a finger swipe gesture on the touch-sensitive surfaceincludes detecting a finger-down event followed by detecting one or morefinger-dragging events, and subsequently followed by detecting afinger-up (lift off) event.

Graphics module 132 includes various known software components forrendering and displaying graphics on touch screen 112 or other display,including components for changing the intensity of graphics that aredisplayed. As used herein, the term “graphics” includes any object thatcan be displayed to a user, including without limitation text, webpages, icons (such as user-interface objects including soft keys),digital images, videos, animations and the like.

In some embodiments, graphics module 132 stores data representinggraphics to be used. Each graphic may be assigned a corresponding code.Graphics module 132 receives, from applications etc., one or more codesspecifying graphics to be displayed along with, if necessary, coordinatedata and other graphic property data, and then generates screen imagedata to output to display controller 156.

Text input module 134, which may be a component of graphics module 132,provides soft keyboards for entering text in various applications (e.g.,contacts 137, e-mail 140, IM 141, browser 147, and any other applicationthat needs text input).

GPS module 135 determines the location of the device and provides thisinformation for use in various applications (e.g., to telephone 138 foruse in location-based dialing, to camera 143 as picture/video metadata,and to applications that provide location-based services such as weatherwidgets, local yellow page widgets, and map/navigation widgets).

Applications 136 may include the following modules (or sets ofinstructions), or a subset or superset thereof:

-   -   contacts module 137 (sometimes called an address book or contact        list);    -   telephone module 138;    -   video conferencing module 139;    -   e-mail client module 140;    -   instant messaging (IM) module 141;    -   workout support module 142;    -   camera module 143 for still and/or video images;    -   image management module 144;    -   browser module 147;    -   calendar module 148;    -   widget modules 149, which may include one or more of: weather        widget 149-1, stocks widget 149-2, calculator widget 149-3,        alarm clock widget 149-4, dictionary widget 149-5, and other        widgets obtained by the user, as well as user-created widgets        149-6;    -   widget creator module 150 for making user-created widgets 149-6;    -   search module 151;    -   video and music player module 152, which may be made up of a        video player    -   module and a music player module;    -   notes module 153;    -   map module 154; and/or    -   online video module 155.

Examples of other applications 136 that may be stored in memory 102include other word processing applications, other image editingapplications, drawing applications, presentation applications,JAVA-enabled applications, encryption, digital rights management, voicerecognition, and voice replication.

In conjunction with touch screen 112, display controller 156, contactmodule 130, graphics module 132, and text input module 134, contactsmodule 137 may be used to manage an address book or contact list (e.g.,stored in application internal state 192 of contacts module 137 inmemory 102 or memory 370), including: adding name(s) to the addressbook; deleting name(s) from the address book; associating telephonenumber(s), e-mail address(es), physical address(es) or other informationwith a name; associating an image with a name; categorizing and sortingnames; providing telephone numbers or e-mail addresses to initiateand/or facilitate communications by telephone 138, video conference 139,e-mail 140, or IM 141; and so forth.

In conjunction with RF circuitry 108, audio circuitry 110, speaker 111,microphone 113, touch screen 112, display controller 156, contact module130, graphics module 132, and text input module 134, telephone module138 may be used to enter a sequence of characters corresponding to atelephone number, access one or more telephone numbers in address book137, modify a telephone number that has been entered, dial a respectivetelephone number, conduct a conversation and disconnect or hang up whenthe conversation is completed. As noted above, the wirelesscommunication may use any of a variety of communications standards,protocols and technologies.

In conjunction with RF circuitry 108, audio circuitry 110, speaker 111,microphone 113, touch screen 112, display controller 156, optical sensor164, optical sensor controller 158, contact module 130, graphics module132, text input module 134, contact list 137, and telephone module 138,videoconferencing module 139 includes executable instructions toinitiate, conduct, and terminate a video conference between a user andone or more other participants in accordance with user instructions.

In conjunction with RF circuitry 108, touch screen 112, displaycontroller 156, contact module 130, graphics module 132, and text inputmodule 134, e-mail client module 140 includes executable instructions tocreate, send, receive, and manage e-mail in response to userinstructions. In conjunction with image management module 144, e-mailclient module 140 makes it very easy to create and send e-mails withstill or video images taken with camera module 143.

In conjunction with RF circuitry 108, touch screen 112, displaycontroller 156, contact module 130, graphics module 132, and text inputmodule 134, the instant messaging module 141 includes executableinstructions to enter a sequence of characters corresponding to aninstant message, to modify previously entered characters, to transmit arespective instant message (for example, using a Short Message Service(SMS) or Multimedia Message Service (MMS) protocol for telephony-basedinstant messages or using XMPP, SIMPLE, or IMPS for Internet-basedinstant messages), to receive instant messages and to view receivedinstant messages. In some embodiments, transmitted and/or receivedinstant messages may include graphics, photos, audio files, video filesand/or other attachments as are supported in a MMS and/or an EnhancedMessaging Service (EMS). As used herein, “instant messaging” refers toboth telephony-based messages (e.g., messages sent using SMS or MMS) andInternet-based messages (e.g., messages sent using XMPP, SIMPLE, orIMPS).

In conjunction with RF circuitry 108, touch screen 112, displaycontroller 156, contact module 130, graphics module 132, text inputmodule 134, GPS module 135, map module 154, and music player module 146,workout support module 142 includes executable instructions to createworkouts (e.g., with time, distance, and/or calorie burning goals);communicate with workout sensors (sports devices); receive workoutsensor data; calibrate sensors used to monitor a workout; select andplay music for a workout; and display, store and transmit workout data.

In conjunction with touch screen 112, display controller 156, opticalsensor(s) 164, optical sensor controller 158, contact module 130,graphics module 132, and image management module 144, camera module 143includes executable instructions to capture still images or video(including a video stream) and store them into memory 102, modifycharacteristics of a still image or video, or delete a still image orvideo from memory 102.

In conjunction with touch screen 112, display controller 156, contactmodule 130, graphics module 132, text input module 134, and cameramodule 143, image management module 144 includes executable instructionsto arrange, modify (e.g., edit), or otherwise manipulate, label, delete,present (e.g., in a digital slide show or album), and store still and/orvideo images.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, and text inputmodule 134, browser module 147 includes executable instructions tobrowse the Internet in accordance with user instructions, includingsearching, linking to, receiving, and displaying web pages or portionsthereof, as well as attachments and other files linked to web pages.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, e-mail client module 140, and browser module 147, calendarmodule 148 includes executable instructions to create, display, modify,and store calendars and data associated with calendars (e.g., calendarentries, to do lists, etc.) in accordance with user instructions.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, and browser module 147, widget modules 149 aremini-applications that may be downloaded and used by a user (e.g.,weather widget 149-1, stocks widget 149-2, calculator widget 1493, alarmclock widget 149-4, and dictionary widget 149-5) or created by the user(e.g., user-created widget 149-6). In some embodiments, a widgetincludes an HTML (Hypertext Markup Language) file, a CSS (CascadingStyle Sheets) file, and a JavaScript file. In some embodiments, a widgetincludes an XML (Extensible Markup Language) file and a JavaScript file(e.g., Yahoo! Widgets).

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, and browser module 147, the widget creator module 150 may beused by a user to create widgets (e.g., turning a user-specified portionof a web page into a widget).

In conjunction with touch screen 112, display system controller 156,contact module 130, graphics module 132, and text input module 134,search module 151 includes executable instructions to search for text,music, sound, image, video, and/or other files in memory 102 that matchone or more search criteria (e.g., one or more user-specified searchterms) in accordance with user instructions.

In conjunction with touch screen 112, display system controller 156,contact module 130, graphics module 132, audio circuitry 110, speaker111, RF circuitry 108, and browser module 147, video and music playermodule 152 includes executable instructions that allow the user todownload and play back recorded music and other sound files stored inone or more file formats, such as MP3 or AAC files, and executableinstructions to display, present or otherwise play back videos (e.g., ontouch screen 112 or on an external, connected display via external port124). In some embodiments, device 100 may include the functionality ofan MP3 player.

In conjunction with touch screen 112, display controller 156, contactmodule 130, graphics module 132, and text input module 134, notes module153 includes executable instructions to create and manage notes, to dolists, and the like in accordance with user instructions.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, GPS module 135, and browser module 147, map module 154 maybe used to receive, display, modify, and store maps and data associatedwith maps (e.g., driving directions; data on stores and other points ofinterest at or near a particular location; and other location-baseddata) in accordance with user instructions.

In conjunction with touch screen 112, display system controller 156,contact module 130, graphics module 132, audio circuitry 110, speaker111, RF circuitry 108, text input module 134, e-mail client module 140,and browser module 147, online video module 155 includes instructionsthat allow the user to access, browse, receive (e.g., by streamingand/or download), play back (e.g., on the touch screen or on anexternal, connected display via external port 124), send an e-mail witha link to a particular online video, and otherwise manage online videosin one or more file formats, such as H.264. In some embodiments, instantmessaging module 141, rather than e-mail client module 140, is used tosend a link to a particular online video.

Each of the above identified modules and applications correspond to aset of executable instructions for performing one or more functionsdescribed above and the methods described in this application (e.g., thecomputer-implemented methods and other information processing methodsdescribed herein). These modules (i.e., sets of instructions) need notbe implemented as separate software programs, procedures or modules, andthus various subsets of these modules may be combined or otherwisere-arranged in various embodiments. In some embodiments, memory 102 maystore a subset of the modules and data structures identified above.Furthermore, memory 102 may store additional modules and data structuresnot described above.

In some embodiments, device 100 is a device where operation of apredefined set of functions on the device is performed exclusivelythrough a touch screen and/or a touchpad. By using a touch screen and/ora touchpad as the primary input control device for operation of device100, the number of physical input control devices (such as push buttons,dials, and the like) on device 100 may be reduced.

The predefined set of functions that may be performed exclusivelythrough a touch screen and/or a touchpad include navigation between userinterfaces. In some embodiments, the touchpad, when touched by the user,navigates device 100 to a main, home, or root menu from any userinterface that may be displayed on device 100. In such embodiments, thetouchpad may be referred to as a “menu button.” In some otherembodiments, the menu button may be a physical push button or otherphysical input control device instead of a touchpad.

FIG. 2 illustrates a portable multifunction device 100 having a touchscreen 112 in accordance with some embodiments. The touch screen maydisplay one or more graphics within user interface (UI) 200. In thisembodiment, as well as others described below, a user may select one ormore of the graphics by making a gesture on the graphics, for example,with one or more fingers 202 (not drawn to scale in the figure) or oneor more styluses 203 (not drawn to scale in the figure).

Device 100 may also include one or more physical buttons, such as “home”or menu button 204. As described previously, menu button 204 may be usedto navigate to any application 136 in a set of applications that may beexecuted on device 100. Alternatively, in some embodiments, the menubutton is implemented as a soft key in a GUI displayed on touch screen112.

In one embodiment, device 100 includes touch screen 112, menu button204, push button 206 for powering the device on/off and locking thedevice, volume adjustment button(s) 208, Subscriber Identity Module(SIM) card slot 210, head set jack 212, and docking/charging externalport 124. Push button 206 may be used to turn the power on/off on thedevice by depressing the button and holding the button in the depressedstate for a predefined time interval; to lock the device by depressingthe button and releasing the button before the predefined time intervalhas elapsed; and/or to unlock the device or initiate an unlock process.In an alternative embodiment, device 100 also may accept verbal inputfor activation or deactivation of some functions through microphone 113.

It should be noted that, although many of the examples herein are givenwith reference to optical sensor/camera 164 (on the front of a device),a rear-facing camera or optical sensor that is pointed opposite from thedisplay may be used instead of or in addition to an opticalsensor/camera 164 on the front of a device.

Example Camera Hardware Embodiments

FIG. 3A illustrates a cutaway view of an example embodiment of a cameramodule or assembly that may, for example, be used to provide in smallform factor cameras, according to at least some embodiments. As shown inFIG. 3A, the camera module 300 includes an image sensor 360 and aflexible printed circuit 340 with a first side affixed to a first sideof the image sensor 360. In some embodiments, a plurality of metallicleads (e.g., 370) are attached to a lead frame 330 and affix to a secondside of the image sensor 360. In some embodiments, the first side of theimage sensor 360 is a side opposite the second side of the image sensor360. In some embodiments, the leads (e.g., 370) provide connectionbetween the image sensor 360 and corresponding leads (not visible) in oron the flexible printed circuit 340. In some embodiments, a lensassembly 310 for directing light to the image sensor 360 is articulatedto the image sensor 360 by one or more of an overmoulding 320 attachedto the lead frame 330 and the flexible printed circuit 340.

In some embodiments, a metallic strip 350 is attached to theovermoulding 320 for electromagnetic shielding of the image sensor 360.In some embodiments, the electromagnetic strip 350 is embedded in theovermoulding 320.

In some alternative embodiments, the camera module 300 further includesa camera actuator motor (not shown) articulated to the overmoulding 320for adjusting a position of a lens of the lens assembly 310 relative tothe image sensor 360.

In some embodiments, the lens assembly 310 includes a fixed focus lensholder for maintaining a fixed position of a lens of the lens assembly310 relative to the image sensor 360.

FIG. 3B depicts an exploded parts view of an example embodiment of acamera module or assembly that may, for example, be used to provide insmall form factor cameras, according to at least some embodiments. Asshown in the exploded view of FIG. 3B, the camera module 305 includes animage sensor 365 and a flexible printed circuit 345 with a first sidethat can be affixed to a first side of the image sensor 365. In someembodiments, a plurality of metallic leads (e.g., 375) are attached to alead frame 330 and available to be affixed to a second side of the imagesensor 365. In some embodiments, the first side of the image sensor 365is a side opposite the second side of the image sensor 365. In someembodiments, the leads (e.g., 375) provide connection between the imagesensor 365 and corresponding leads (not visible) in or on the flexibleprinted circuit 345. In some embodiments, a lens assembly 315 fordirecting light to the image sensor 365 is articulated to the imagesensor 365 by one or more of an overmoulding 325 attached to the leadframe 335 and the flexible printed circuit 345. In some embodiments, thelead frame 335 is removed during assembly to leave only the leads inplace.

In some embodiments, a metallic strip 355 is attached to theovermoulding 325 for electromagnetic shielding of the image sensor 365.In some embodiments, the electromagnetic strip 355 is embedded in theovermoulding 325.

In some alternative embodiments, the camera module 305 further includesa camera actuator motor (not shown) articulated to the overmoulding 325for adjusting a position of a lens of the lens assembly 315 relative tothe image sensor 365.

In some embodiments, the lens assembly 315 includes a fixed focus lensholder for maintaining a fixed position of a lens of the lens assembly315 relative to the image sensor 365. In some embodiments, image sensor365 will have a TSV/RDL at the bottom that connects directly to theflexible printed circuit 345.

Example Camera Hardware Embodiment Assembly Process

FIG. 3C is a flowchart of an assembly process for assembling a cameramodule, according to at least some embodiments. An image sensor isarticulated to leads of a lead frame (block 302). An example of such anoperation is visible as FIG. 5. A flexible printed circuit isarticulated to the image sensor and leads of the lead frame (block 304).An example of such an operation is visible as FIG. 7. An overmoulding isarticulated to the flexible printed circuit, the image sensor and thelead frame (block 306). An example of such an operation is visible asFIG. 9 A lens assembly is articulated to the overmoulding (block 308).An example of such an operation is visible as FIG. 11.

FIG. 4 depicts a lead frame apparatus representing an embodiment of alead frame for an image sensor that may, for example, be used in smallform factor cameras, according to at least some embodiments. Lead frame440 includes an array of leads (e.g., 470) to provide connection betweenthe image sensor (not shown) and corresponding leads (not visible) in oron the flexible printed circuit (not shown) by means of contact pads 472and 474.

FIG. 5 illustrates a lead frame apparatus and an image sensor that may,for example, be used in small form factor cameras, according to at leastsome embodiments. Lead frame 540 includes an array of leads (e.g., 570)to provide connection between the image sensor (560) and correspondingleads (not visible) in or on the flexible printed circuit (not shown) bymeans of contact pads 572 and 574.

FIG. 6 depicts articulation of a lead frame apparatus and an imagesensor that may, for example, be used in small form factor cameras,according to at least some embodiments. Lead frame 640 includes an arrayof leads (e.g., 670) to provide connection between the image sensor(660) and corresponding leads (not visible) in or on the flexibleprinted circuit (not shown).

FIG. 7 illustrates articulation of a flexible printed circuit to a leadframe apparatus and an image sensor that may, for example, be used insmall form factor cameras, according to at least some embodiments. FIG.7 shows an image sensor 760 and a flexible printed circuit 740 with afirst side that can be affixed to a first side of the image sensor 760.In some embodiments, a plurality of metallic leads (e.g., 770) areattached to a lead frame 730 and available to be affixed to a secondside of the image sensor 760. In some embodiments, the first side of theimage sensor 760 is a side opposite the second side of the image sensor760. In some embodiments, the leads (e.g., 770) provide connectionbetween the image sensor 760 and corresponding leads (not visible) in oron the flexible printed circuit 740.

FIG. 8 depicts an assembly resulting from articulation of a flexibleprinted circuit to a lead frame apparatus and an image sensor that may,for example, be used in small form factor cameras, according to at leastsome embodiments. FIG. 8 shows an image sensor 860 and a flexibleprinted circuit 840 with a first side that can be affixed to a firstside of the image sensor 860. In some embodiments, a plurality ofmetallic leads (e.g., 870) are attached to a lead frame 830 andavailable to be affixed to a second side of the image sensor 860. Insome embodiments, the first side of the image sensor 860 is a sideopposite the second side of the image sensor 860. In some embodiments,the leads (e.g., 870) provide connection between the image sensor 860and corresponding leads (not visible) in or on the flexible printedcircuit 840.

FIG. 9 illustrates an assembly resulting from articulation of anovermoulding to a flexible printed circuit, a lead frame apparatus, andan image sensor that may, for example, be used in small form factorcameras, according to at least some embodiments. As shown in FIG. 9, thecamera assembly 900 includes an image sensor 960 and a flexible printedcircuit 940 with a first side affixed to a first side of the imagesensor 960. In some embodiments, a plurality of metallic leads (notvisible) are attached to a lead frame 930 and affix to a second side ofthe image sensor 960. In some embodiments, the first side of the imagesensor 960 is a side opposite the second side of the image sensor 960.In some embodiments, the leads (not visible) provide connection betweenthe image sensor 960 and corresponding leads (not visible) in or on theflexible printed circuit 940. In some embodiments, in some embodiments,the assembly 900 includes an overmoulding 920 attached to the lead frame990 and the flexible printed circuit 940.

In some embodiments, a metallic strip 950 is attached to theovermoulding 920 for electromagnetic shielding of the image sensor 960.In some embodiments, the electromagnetic strip 950 is embedded in theovermoulding 920.

FIG. 10 depicts an assembly resulting from articulation of anovermoulding to a flexible printed circuit, a lead frame apparatus, andan image sensor that may, for example, be used in small form factorcameras, according to at least some embodiments. As shown in FIG. 10,the camera assembly 1000 includes an image sensor (not visible) and aflexible printed circuit 1040 with a first side affixed to a first sideof the image sensor 1060. In some embodiments, a plurality of metallicleads (not visible) are attached to a lead frame 1030 and affix to asecond side of the image sensor (not visible). In some embodiments, thefirst side of the image sensor (not visible) is a side opposite thesecond side of the image sensor (not visible). In some embodiments, theleads (not visible) provide connection between the image sensor (notvisible) and corresponding leads (not visible) in or on the flexibleprinted circuit 1040. In some embodiments, the assembly includes anovermoulding 1020 attached to the lead frame 1020 and the flexibleprinted circuit 1040.

In some embodiments, a metallic strip 1050 is attached to theovermoulding 1020 for electromagnetic shielding of the image sensor (notvisible). In some embodiments, the electromagnetic strip 1050 isembedded in the overmoulding 1020.

FIG. 11 illustrates articulation of a lens assembly to an assemblyresulting from articulation of an overmoulding to a flexible printedcircuit, a lead frame apparatus, and an image sensor that may, forexample, be used in small form factor cameras, according to at leastsome embodiments. A lens module 1110 is articulated to an overmoulding1120 of an assembly 1100 including a flexible printed circuit 1140 and ametallic shielding strip.

In some embodiments, the lens assembly 1110 includes a fixed focus lensholder for maintaining a fixed position of a lens of the lens assembly1110 relative to the image sensor (not visible).

FIG. 12 depicts articulation of a flexible printed circuit to a metallicstiffener that may, for example, be used in small form factor cameras,according to at least some embodiments. A flexible printed circuit 1240is placed atop a metallic stiffener 1280.

FIG. 13 illustrates articulation of a flexible printed circuit to a leadframe apparatus, a metallic stiffener, and an image sensor that may, forexample, be used in small form factor cameras, according to at leastsome embodiments. An image sensor 1360 is placed atop the flexibleprinted circuit 1340 and the metallic stiffener 1380. In someembodiments, a lead frame is also placed in the assemblage (notvisible).

FIG. 14 illustrates articulation of a carrier frame to a flexibleprinted circuit, a lead frame apparatus, a metallic stiffener, and animage sensor that may, for example, be used in small form factorcameras, according to at least some embodiments. A copper cover, alsocalled a carrier frame 1490, is placed atop the flexible printed circuit1440 and the metallic stiffener 1480 without obscuring the image sensor1460.

FIG. 15 depicts a result of the articulation of a carrier frame to aflexible printed circuit, a lead frame apparatus, a metallic stiffener,and an image sensor that may, for example, be used in small form factorcameras, according to at least some embodiments. A copper cover, alsocalled a carrier frame 1590, is visible atop the flexible printedcircuit 1540 and the metallic stiffener (not visible) without obscuringthe image sensor 1560.

FIG. 16 illustrates articulation of an overmoulding to a result of thearticulation of a carrier frame to a flexible printed circuit, a leadframe apparatus, a metallic stiffener, and an image sensor that may, forexample, be used in small form factor cameras, according to at leastsome embodiments. An overmoulding 1620 is placed atop the flexibleprinted circuit 1640 and the metallic stiffener (not visible) withoutobscuring the image sensor 1660. The carrier frame 1690 remains uncut.

FIG. 17 depicts a result of removal of surplus metal from anarticulation of an overmoulding to a result of the articulation of acarrier frame to a flexible printed circuit, a lead frame apparatus, ametallic stiffener, and an image sensor that may, for example, be usedin small form factor cameras, according to at least some embodiments.Excess metal is removed from the articulation of the overmoulding 1720atop the flexible printed circuit 1740, and the metallic stiffener 1780is folded to create attachment ledges (and in some embodiments epoxied)for securing the overmoulding, protecting the image sensor 1660. Theflexible printed circuit 1740 is also freed from excess carrier framematerial.

FIG. 18 illustrates a result of removal of surplus metal from anarticulation of an overmoulding to a result of the articulation of acarrier frame to a flexible printed circuit, a lead frame apparatus, ametallic stiffener, and an image sensor that may, for example, be usedin small form factor cameras, according to at least some embodiments. Acamera module 1800 includes an image sensor 1860, a flexible printedcircuit with a first side affixed to a first side of the image sensor(beneath metallic cover metallic cover 1840), a metallic stiffeneraffixed to a second side of the flexible printed circuit (not visible).In some embodiments, the second side of the flexible printed circuit isopposite a first side of the flexible printed circuit. In someembodiments, the metallic stiffener includes one or more ledges (1880)folded to enclose the overmoulding on one or more sides. In someembodiments, the metallic stiffener comprises one or more ledges epoxiedto the overmoulding on one or more sides.

Additional Example Camera Hardware

FIG. 19 depicts a side view of an example embodiment of an actuatormodule or assembly that may, for example, be used to provide a moveablelens package suitable for use with at least some embodiments.

In addition to use with fixed-position lenses, some embodiments may beapplied within a camera, actuator package or image sensor assembly 19000interacting with an image sensor 19050 as illustrated in FIG. 19 tostabilize and increase control performance of an optics assembly 19002suspended on wires 19020 within an actuator package 19000 a-c as shownin FIG. 19.

In some embodiments, each position control magnet 19006 is poled so asto generate a magnetic field, the useful component of which for theautofocus function is orthogonal to the optical axis of the camera/lens,and orthogonal to the plane of each magnet 19006 proximate to theautofocus coil 19004, and where the field for all four magnets 19006 areall either directed towards the autofocus coil 19004, or away from it,so that the Lorentz forces from all four magnets 19004 act in the samedirection along the optical axis 19080.

As shown in FIG. 19, an actuator package 19000 may include a baseassembly or substrate 19008, an optics assembly 19002, and a cover19012. Base assembly 19008 may include one or more of, but is notlimited to, a base 19008, supporting one or more position sensors (e.g.,capacitor plates) 19010 a-b, and suspension wires 19020.

In at least some embodiments, there are four suspension wires 19020. Anoptics assembly 19002 may be suspended on the base assembly 19008 bysuspension of the upper springs 19040 of optics assembly 19000 on thesuspension wires 19020. Actuator module 19000 may include one or moreof, but is not limited to, optics 19002, optics holder (autofocus coil)19004, magnet(s) 19006, upper spring(s) 19040, and lower spring(s)19042. The upper and lower spring(s) may be collectively referred toherein as optics springs. In optics assembly 19000, an optics component19002 (e.g., a lens or lens assembly) may be screwed, mounted orotherwise held in or by an optics holder (autofocus coil) 19004. In atleast some embodiments, the optics 19002/optics holder (autofocus coil)19004 assembly may be suspended from or attached to the position controlmagnets 19006 by upper spring(s) 19040, and lower spring(s) 19042, andthe position control magnets 19006 may be rigidly mounted to base 19008.Note that upper spring(s) 19040 and lower spring(s) 19042 are flexibleto allow the optics assembly 19000 a range of motion along the Z(optical) axis for optical focusing, wires 19020 are flexible to allow arange of motion on the XY plane orthogonal to the optical axis foroptical image stabilization.

Note that, in some embodiments, an optics assembly 19000 or an actuatoractuator module may not include position control magnets 19006, but mayinclude a yoke or other structure 19006 that may be used to help supportthe optics assembly on suspension wires 19020 via upper springs 190190.However in some embodiments, optics assembly 19000 may not includeelements 19006. In general, other embodiments of an optics assembly19000 may include fewer or more components than the example opticsassembly 19000 shown in FIG. 19. Also note that, while embodiments showthe optics assembly 19000 suspended on wires 19020, other mechanisms maybe used to suspend an optics assembly 19000 in other embodiments.

The autofocus yoke (e.g., magnets or holder(s) 19006) acts as thesupport chassis structure for the autofocus mechanism of actuator 19000.The lens carrier (optics holder 19004) is suspended on the autofocusyoke by an upper autofocus (AF) spring 19040 and a lower optics spring19042. In this way when an electric current is applied to the autofocuscoil, Lorentz forces are developed due to the presence of the fourmagnets, and a force substantially parallel to the optical axis isgenerated to move the lens carrier, and hence lens, along the opticalaxis, relative to the support structure of the autofocus mechanism ofthe actuator, so as to focus the lens. In addition to suspending thelens carrier and substantially eliminating parasitic motions, the upperspring 19040 and lower spring 4042 also resist the Lorentz forces, andhence convert the forces to a displacement of the lens. This basicarchitecture shown in FIG. 19 and is typical of some embodiments, inwhich optical image stabilization function includes moving the entireautofocus mechanism of the actuator (supported by the autofocus yoke) inlinear directions orthogonal to the optical axis, in response to userhandshake, as detected by some means, such a two or three axisgyroscope, which senses angular velocity. The handshake of interest isthe changing angular tilt of the camera in ‘pitch and yaw directions’,which can be compensated by said linear movements of the lens relativeto the image sensor.

At least some embodiments may achieve this two independentdegree-of-freedom motion by using two pairs of optical imagestabilization coils, each pair acting together to deliver controlledmotion in one linear axis orthogonal to the optical axis, and each pairdelivering controlled motion in a direction substantially orthogonal tothe other pair. In at least some embodiments, these optical imagestabilization coils may be fixed to the camera actuator supportstructure, and when current is appropriately applied, optical imagestabilization coils may generate Lorentz forces on the entire autofocusmechanism of the actuator, moving it as desired. The required magneticfields for the Lorentz forces are produced by the same four magnets thatenable to the Lorentz forces for the autofocus function. However, sincethe directions of motion of the optical image stabilization movementsare orthogonal to the autofocus movements, it is the fringing field ofthe four magnets that are employed, which have components of magneticfield in directions parallel to the optical axis.

Returning to FIG. 19, in at least some embodiments, the suspension ofthe autofocus mechanism on the actuator 19000 support structure may beachieved by the use of four corner wires 19020, for example wires with acircular cross-section. Each wire 19020 acts as a flexure beams capableof bending with relatively low stiffness, thus allowing motion in bothoptical image stabilization degrees-of-freedom. However, wire 19020 isin some embodiments relatively stiff in directions parallel to theoptical axis, as this would require the wire to stretch or buckle, thussubstantially preventing parasitic motions in these directions. Inaddition, the presence of four such wires, appropriately separatedallows them to be stiff in the parasitic tilt directions of pitch andyaw, thus substantially preventing relative dynamic tilt between thelens and image sensor. This may be seen by appreciating that each wire19020 is stiff in directions that require it to change in length, andhence the fixed points at the ends of each wire (eight points in total)will substantially form the vertices of a parallelepiped for alloperational positions of the optical image stabilization mechanism.

In some embodiments, a package of processors and memory 19090 or othercomputer-readable medium as described herein may alternatively, in someembodiments, be omitted from actuator module 19000 and housed elsewherein a device in which actuator package 19000 is installed.

In some embodiments, actuator package 19000 is installed in a camera ofa mobile computing device.

Some embodiments include an image sensor structure 19050 mounted to anovermoulding 19054, flexible printed circuit, lead frame 19058 andstiffener 19056, as described herein.

Example Manufacturing Processes

FIG. 20 is a flowchart of a method for manufacturing a camera assembly,according to at least some embodiments. An image sensor is attached to aflexible printed circuit with a first side affixed to a first side ofthe image sensor (block 2020). A metallic stiffener is attached to asecond side of the flexible printed circuit, such that the second sideof the flexible printed circuit is opposite a first side of the flexibleprinted circuit (block 2030).

FIG. 21 is a flowchart of a method for manufacturing a camera assembly,according to at least some embodiments. An image sensor is attached to aflexible printed circuit with a first side affixed to a first side ofthe image sensor (block 2120). A metallic stiffener is attached to asecond side of the flexible printed circuit, such that the second sideof the flexible printed circuit is opposite a first side of the flexibleprinted circuit (block 2130). The metallic stiffener is folded to createone or more ledges to enclose the overmolding on one or more sides(block 2140).

FIG. 22 is a flowchart of a method for manufacturing a camera assembly,according to at least some embodiments. An image sensor is attached to aflexible printed circuit with a first side affixed to a first side ofthe image sensor (block 2120). A metallic stiffener is attached to asecond side of the flexible printed circuit, such that the second sideof the flexible printed circuit is opposite a first side of the flexibleprinted circuit (block 2130). A plurality of metallic leads is affixedto a second side of the image sensor (block 2240).

Example Computer System

FIG. 23 illustrates an example computer system 2300 that may beconfigured to execute any or all of the embodiments described above. Indifferent embodiments, computer system 2300 may be any of various typesof devices, including, but not limited to, a personal computer system,desktop computer, laptop, notebook, tablet, slate, pad, or netbookcomputer, mainframe computer system, handheld computer, workstation,network computer, a camera, a set top box, a mobile device, a consumerdevice, video game console, handheld video game device, applicationserver, storage device, a television, a video recording device, aperipheral device such as a switch, modem, router, or in general anytype of computing or electronic device.

Various embodiments of a camera motion control system as describedherein, or of manufacturing processes for camera modules and components,as described herein may be executed in one or more computer systems2300, which may interact with various other devices. Note that anycomponent, action, or functionality described above with respect toFIGS. 1-10 may be implemented on one or more computers configured ascomputer system 2300 of FIG. 23, according to various embodiments. Inthe illustrated embodiment, computer system 2300 includes one or moreprocessors 2310 coupled to a system memory 2320 via an input/output(I/O) interface 2330. Computer system 2300 further includes a networkinterface 2340 coupled to I/O interface 2330, and one or moreinput/output devices 2350, such as cursor control device 2360, keyboard2370, and display(s) 2380. In some cases, it is contemplated thatembodiments may be implemented using a single instance of computersystem 2300, while in other embodiments multiple such systems, ormultiple nodes making up computer system 2300, may be configured to hostdifferent portions or instances of embodiments. For example, in oneembodiment some elements may be implemented via one or more nodes ofcomputer system 2300 that are distinct from those nodes implementingother elements.

In various embodiments, computer system 2300 may be a uniprocessorsystem including one processor 2310, or a multiprocessor systemincluding several processors 2310 (e.g., two, four, eight, or anothersuitable number). Processors 2310 may be any suitable processor capableof executing instructions. For example, in various embodimentsprocessors 2310 may be general-purpose or embedded processorsimplementing any of a variety of instruction set architectures (ISAs),such as the x86, PowerPC, SPARC, or MIPS ISAs, or any other suitableISA. In multiprocessor systems, each of processors 2310 may commonly,but not necessarily, implement the same ISA.

System memory 2320 may be configured to store camera control programinstructions 2322 and/or camera control data accessible by processor2310. In various embodiments, system memory 2320 may be implementedusing any suitable memory technology, such as static random accessmemory (SRAM), synchronous dynamic RAM (SDRAM), nonvolatile/Flash-typememory, or any other type of memory. In the illustrated embodiment,program instructions 2322 may be configured to implement a lens controlapplication 2324 incorporating any of the functionality described above.Additionally, existing camera control data 2332 of memory 2320 mayinclude any of the information or data structures described above. Insome embodiments, program instructions and/or data may be received, sentor stored upon different types of computer-accessible media or onsimilar media separate from system memory 2320 or computer system 2300.While computer system 2300 is described as implementing thefunctionality of functional blocks of previous Figures, any of thefunctionality described herein may be implemented via such a computersystem.

In one embodiment, I/O interface 2330 may be configured to coordinateI/O traffic between processor 2310, system memory 2320, and anyperipheral devices in the device, including network interface 2340 orother peripheral interfaces, such as input/output devices 2350. In someembodiments, I/O interface 2330 may perform any necessary protocol,timing or other data transformations to convert data signals from onecomponent (e.g., system memory 2320) into a format suitable for use byanother component (e.g., processor 2310). In some embodiments, I/Ointerface 2330 may include support for devices attached through varioustypes of peripheral buses, such as a variant of the Peripheral ComponentInterconnect (PCI) bus standard or the Universal Serial Bus (USB)standard, for example. In some embodiments, the function of I/Ointerface 2330 may be split into two or more separate components, suchas a north bridge and a south bridge, for example. Also, in someembodiments some or all of the functionality of I/O interface 2330, suchas an interface to system memory 2320, may be incorporated directly intoprocessor 2310.

Network interface 2340 may be configured to allow data to be exchangedbetween computer system 2300 and other devices attached to a network2385 (e.g., carrier or agent devices) or between nodes of computersystem 2300. Network 2385 may in various embodiments include one or morenetworks including but not limited to Local Area Networks (LANs) (e.g.,an Ethernet or corporate network), Wide Area Networks (WANs) (e.g., theInternet), wireless data networks, some other electronic data network,or some combination thereof. In various embodiments, network interface2340 may support communication via wired or wireless general datanetworks, such as any suitable type of Ethernet network, for example;via telecommunications/telephony networks such as analog voice networksor digital fiber communications networks; via storage area networks suchas Fibre Channel SANs, or via any other suitable type of network and/orprotocol.

Input/output devices 2350 may, in some embodiments, include one or moredisplay terminals, keyboards, keypads, touchpads, scanning devices,voice or optical recognition devices, or any other devices suitable forentering or accessing data by one or more computer systems 2300.Multiple input/output devices 2350 may be present in computer system2300 or may be distributed on various nodes of computer system 2300. Insome embodiments, similar input/output devices may be separate fromcomputer system 2300 and may interact with one or more nodes of computersystem 2300 through a wired or wireless connection, such as over networkinterface 2340.

As shown in FIG. 23, memory 2320 may include program instructions 2322,which may be processor-executable to implement any element or actiondescribed above. In one embodiment, the program instructions mayimplement the methods described above. In other embodiments, differentelements and data may be included. Note that data may include any dataor information described above.

Those skilled in the art will appreciate that computer system 2300 ismerely illustrative and is not intended to limit the scope ofembodiments. In particular, the computer system and devices may includeany combination of hardware or software that can perform the indicatedfunctions, including computers, network devices, Internet appliances,PDAs, wireless phones, pagers, etc. Computer system 2300 may also beconnected to other devices that are not illustrated, or instead mayoperate as a stand-alone system. In addition, the functionality providedby the illustrated components may in some embodiments be combined infewer components or distributed in additional components. Similarly, insome embodiments, the functionality of some of the illustratedcomponents may not be provided and/or other additional functionality maybe available.

Those skilled in the art will also appreciate that, while various itemsare illustrated as being stored in memory or on storage while beingused, these items or portions of them may be transferred between memoryand other storage devices for purposes of memory management and dataintegrity. Alternatively, in other embodiments some or all of thesoftware components may execute in memory on another device andcommunicate with the illustrated computer system via inter-computercommunication. Some or all of the system components or data structuresmay also be stored (e.g., as instructions or structured data) on acomputer-accessible medium or a portable article to be read by anappropriate drive, various examples of which are described above. Insome embodiments, instructions stored on a computer-accessible mediumseparate from computer system 2300 may be transmitted to computer system2300 via transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as a network and/or a wireless link. Various embodiments mayfurther include receiving, sending or storing instructions and/or dataimplemented in accordance with the foregoing description upon acomputer-accessible medium. Generally speaking, a computer-accessiblemedium may include a non-transitory, computer-readable storage medium ormemory medium such as magnetic or optical media, e.g., disk orDVD/CD-ROM, volatile or non-volatile media such as RAM (e.g. SDRAM, DDR,RDRAM, SRAM, etc.), ROM, etc. In some embodiments, a computer-accessiblemedium may include transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as network and/or a wireless link.

The methods described herein may be implemented in software, hardware,or a combination thereof, in different embodiments. In addition, theorder of the blocks of the methods may be changed, and various elementsmay be added, reordered, combined, omitted, modified, etc. Variousmodifications and changes may be made as would be obvious to a personskilled in the art having the benefit of this disclosure. The variousembodiments described herein are meant to be illustrative and notlimiting. Many variations, modifications, additions, and improvementsare possible. Accordingly, plural instances may be provided forcomponents described herein as a single instance. Boundaries betweenvarious components, operations and data stores are somewhat arbitrary,and particular operations are illustrated in the context of specificillustrative configurations. Other allocations of functionality areenvisioned and may fall within the scope of claims that follow. Finally,structures and functionality presented as discrete components in theexample configurations may be implemented as a combined structure orcomponent. These and other variations, modifications, additions, andimprovements may fall within the scope of embodiments as defined in theclaims that follow.

What is claimed is:
 1. A camera module comprising: an image sensor; aflexible printed circuit with a first side affixed to a first side ofthe image sensor; a plurality of metallic leads affixed to a second sideof the image sensor, wherein the first side of the image sensor is aside opposite the second side of the image sensor, the leads provideconnection between the image sensor and corresponding leads in theflexible printed circuit; a lens assembly for directing light to theimage sensor articulated to the image sensor by one or more of anovermoulding attached to the leads and the flexible printed circuit. 2.The camera module of claim 1, further comprising: a metallic strip forelectromagnetic shielding of the image sensor, wherein theelectromagnetic strip is embedded in the overmoulding.
 3. The cameramodule of claim 1, wherein the camera module further comprises a cameraactuator motor articulated to the overmoulding for adjusting a positionof a lens of the lens assembly relative to the image sensor.
 4. Thecamera module of claim 1, wherein the lens assembly comprises a fixedfocus lens holder for maintaining a fixed position of a lens of the lensassembly relative to the image sensor.
 5. The camera module of claim 1,further comprising: a metallic stiffener affixed to a second side of theflexible printed circuit, wherein the second side of the flexibleprinted circuit is opposite a first side of the flexible printedcircuit, the metallic stiffener comprises one or more ledges folded toenclose the overmoulding on one or more sides.
 6. The camera module ofclaim 1, further comprising: a metallic stiffener affixed to a secondside of the flexible printed circuit, wherein the second side of theflexible printed circuit is opposite a first side of the flexibleprinted circuit.
 7. The camera module of claim 1, wherein the cameramodule further comprises a voice coil motor articulated to theovermoulding for adjusting a position of a lens of the lens assemblyrelative to the image sensor.
 8. An image sensor assembly comprising: animage sensor; a flexible printed circuit with a first side affixed to afirst side of the image sensor; and a metallic stiffener affixed to asecond side of the flexible printed circuit, wherein the second side ofthe flexible printed circuit is opposite a first side of the flexibleprinted circuit.
 9. The image sensor assembly of claim 8, wherein themetallic stiffener comprises one or more ledges folded to enclose theovermoulding on one or more sides.
 10. The image sensor assembly ofclaim 8, wherein the metallic stiffener comprises one or more ledgesepoxied to the overmoulding on one or more sides.
 11. The image sensorassembly of claim 8, further comprising: a plurality of metallic leadsaffixed to a second side of the image sensor, wherein the leads provideconnection between the image sensor and leads in the flexible printedcircuit.
 12. The image sensor assembly of claim 8, further comprising: aplurality of metallic leads affixed to a second side of the imagesensor, wherein the plurality of metallic leads provides a wire bondconnection from the flexible printed circuit to the image sensor. 13.The image sensor assembly of claim 8, further comprising: a plurality ofmetallic leads affixed to a second side of the image sensor, wherein theplurality of metallic leads provides a connection from the flexibleprinted circuit to the image sensor through a pillar bump comprising acopper alloy.
 14. The image sensor assembly of claim 8, furthercomprising: a plurality of metallic leads affixed to a second side ofthe image sensor, wherein the first side of the image sensor is a sideopposite the second side of the image sensor, and the leads provideconnection between the image sensor and leads in the flexible printedcircuit.
 15. A method for assembling an image sensor assembly, themethod comprising: attaching an image sensor to a flexible printedcircuit with a first side affixed to a first side of the image sensor;and attaching a metallic stiffener to a second side of the flexibleprinted circuit, wherein the second side of the flexible printed circuitis opposite a first side of the flexible printed circuit.
 16. The methodof claim 15, further comprising folding the metallic stiffener to createone or more ledges to enclose an overmoulding on one or more sides. 17.The method of claim 15, further comprising dispensing epoxy onto themetallic stiffener to secure one or more ledges to an overmoulding onone or more sides.
 18. The method of claim 15, further comprisingattaching a plurality of metallic leads affixed to a second side of theimage sensor, wherein the leads provide connection between the imagesensor and leads in the flexible printed circuit.
 19. The method ofclaim 15, further comprising attaching a plurality of metallic leadsaffixed to a second side of the image sensor, wherein the plurality ofmetallic leads provides a wire bond connection from the flexible printedcircuit to the image sensor.
 20. The method of claim 15, furthercomprising attaching a plurality of metallic leads affixed to a secondside of the image sensor, wherein the plurality of metallic leadsprovides a connection from the flexible printed circuit to the imagesensor through a pillar bump comprising a copper alloy.